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| Customization: | Available |
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| Certification: | ISO |
| Application: | Insulation |
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Crafted from ultrafine E-glass fibers using precision weaving technology, this ultra-thin fabric redefines material engineering standards.
Excellent Electrical Properties: High insulation, low dielectric constant (Dk), and low dissipation factor (Df), ensuring minimal signal loss and high integrity during transmission in PCBs.
Good Mechanical Strength: High tensile strength and toughness in both warp and weft directions, providing reliable mechanical support for PCBs.
High Thermal Stability: The fiberglass itself is non-flammable and heat-resistant, capable of withstanding high-temperature lamination and soldering processes in PCB manufacturing.
Dimensional Stability: Minimal shrinkage or deformation, ensuring precision in PCB dimensions.
Excellent Resin Impregnation: Compatible with matrix resins such as epoxy, facilitating strong bonding and forming robust composite materials.
| Style | Count(per inch) Warp×Fill | Yarn Nomenclature Warp×Fill | Weight (g/m2) | Thickness (mm) | LOI (%) |
| 1010 | 96×96 | BC3750 1/0×BC3750 1/0 | 10±1 | 0.011±0.002 | 0.15±0.04 |
| 1000 | 85×85 | BC3000 1/0×BC3000 1/0 | 11±1 | 0.012±0.002 | 0.15±0.04 |
| 1017 | 95×95 | BC3000 1/0×BC3000 1/0 | 12±1 | 0.014±0.002 | 0.15±0.04 |
| 1015 | 96×96 | BC2250 1/0×BC2250 1/0 | 17±2 | 0.015±0.003 | 0.12±0.04 |
| 1027 | 74×74 | BC1500 1/0×BC1500 1/0 | 20±2 | 0.020±0.005 | 0.12±0.04 |
| 1024 | 91×91 | BC1500 1/0×BC1500 1/0 | 24±2 | 0.022±0.005 | 0.12±0.04 |
| 1037 | 70×72 | C1200 1/0×C1200 1/0 | 24±2 | 0.025±0.005 | 0.12±0.04 |
| 1030 | 91×91 | C1200 1/0×C1200 1/0 | 31±2 | 0.028±0.005 | 0.12±0.04 |
| 106 | 56×56 | D900 1/0 × D900 1/0 | 24±2 | 0.030±0.005 | 0.12±0.04 |
| 1035 | 66×68 | D900 1/0 × D900 1/0 | 29±2 | 0.030±0.005 | 0.12±0.04 |
| 1067 | 71×69 | D900 1/0 × D900 1/0 | 30±2 | 0.030±0.005 | 0.12±0.04 |
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