Customization: | Available |
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After-sales Service: | 1year |
Warranty: | 1year |
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Epoxy insulation board: It is made of glass fiber cloth and epoxy resin bonded by heating and pressing.
WIth high mechanical properties at medium temperature and stable electrical properties at high temperature.
Has high mechanical and dielectric properties, as well as good heat and moisture resistance. Heat resistance class F (155 ºC).
Suitable for high-insulation structural parts for machinery, electrical appliances and electronics.
Thickness: 0.5~100mm
Regular size: 1000mm*2000mm
1. Various forms. A wide variety of resins, curing agents, and modifier systems are available to suit virtually every application's form requirements, ranging from very low viscosities to high melting point solids.
2. Easy to cure. Epoxy resin system can be cured in the temperature range of 0~180ºC.
3. Strong adhesion. Epoxy resins have low shrinkage when cured and generate little internal stress, which also contributes to improved adhesion strength.
4. Low shrinkage. The curing agent reacts without the evolution of water or other volatile by-products. Very low shrinkage (less than 2%) during curing.
5. Mechanical properties. The cured epoxy resin system has excellent mechanical properties.
No. | Item | Unit | Standard Value | |
1 | Density | g/cm3 | 1.7-1.9 | |
2 | Bending Strength | MD | Mpa | ≥392 |
TD | ≥294 | |||
3 | Tensile Strength | MD | Mpa | ≥343 |
TD | ≥245 | |||
4 | Martens temperature (MD) | ºC | ≥200 | |
5 | Adhesive Strength | N | ≥5684 | |
6 | Impact strength | MD | KJ/m² | ≥150 |
TD | ≥100 | |||
7 | Surface Resistivity | In normal condition | MΩ ▪ m | ≥1.0 x 105 |
after immersion in water | ≥1.0 x 103 | |||
8 | Parallel layer insulation resistance | In normal condition | MΩ | ≥1.0 x 104 |
after immersion in water | ≥1.0 x 102 | |||
9 | Dielectric Loss Angle Tangent (50Hz) | ≤0.050 | ||
10 | Vertical layer to electrical strength(1mm) (90 ±2 ºC in oil) | MV/m | ≥18 | |
11 | Parallel layers breakdown voltage (90± 2 ºC in oil) | KV | ≥30 |